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Suitable Machines for
Production of MultiLayer based
electronic components – MLCC, MLCI, MLCV, LTCC,...
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Multi-Layer Ceramic Capacitors
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Multi-Layer Chip Inductors
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Multi-Layer Chip Varistors
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Low Temperature Co fired Components
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and others such as: Piezo, HTCC,
EMI filters, etc. multi-layer based electronic components have similar production
technologies, based on thin layer ceramic technology.
Keko Equipment is offering suitable machines for all major known
production technologies of above components.
There are two core technologies
known, so-called dry and wet technology.
Nowadays dry technology is most
commonly used for production of MLCC, MLCI etc. components.
Here are basic production steps
and suitable machines for dry production process:
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Ceramic slurry preparing:
(BL-6A) Purpose of this step is to prepare ceramic powder to thin layer cast
able suspension. For this purpose different types of jar mils are used.
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Casting:
( CAM-22,
CAM-M1) To form thin ceramic foil from
suspension for MLCC and other multilayer based components casting machines are used.
You can chose between
two different types of machines depending
on further technology steps:
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- CAM-22
produces free standing ceramic tape
and
- CAM-M1
produces ceramic tape cast on carrier film.
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Pattern printing and
stacking:
Two technologies are used to print pattern on the ceramic tape:
 | print on stack tech where
stacking and printing is done simultaneously (PAL-9, FSP-10 for ferrites)
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| separate printing and separate
stacking (automatic run RTP-10 + stacker ST-10 or for manual operation one of
our P-160 to P-200A printers can be used and IS-3M manual stacker or IS-3A
automatic stacker).
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| Individual printed sheets can by dried in a (dryer SD-3).
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Punching:
Some
components like MLCI or LTCC requires punched sheets before printing and
stacking to be used in order to have connections between individual layers
(PAM-4S). Punched sheet requires via filling in order to have good connections
between the layers. For this application a P-200AVF printer can be used.
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Laminating:
After
stacking the stack has to be laminated by pressure and temperature in order to
achieve compact stack. For most components, including MLCC, isocratic pressing process is used
in order to achieve uniform pressure on the surface (ILS-6A machine). For some
components an axial press is used (TPR-8)
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Slitting:
Is a process where the stack is cut after laminating in
to individual pieces. For this purpose our CM-14 automatic cutter can be used.
If the technology requires individual sheets before printing a SC-1 sheet
cutter cuts the sheets automatically from a roll of tape.
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In further steps a
cofiring,
contact termination (ILS-6A), testing & sorting (CS-10) and packaging (CTM-12)
is done.
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The most suitable technology
for particular application depends on products type, production volume and
dimension of product.
Please contact Keko Equipment
for MLCC, MLCI, MLCV, LTCC,... particular application.
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