Production of MultiLayer based electronic components – MLCC, MLCI, MLCV, LTCC
 

Keko Equipment is offering suitable machines for all major known production technologies of the following components:
  • Multi-Layer Ceramic Capacitors
  • Multi-Layer Chip Inductors
  • Multi-Layer Chip Varistors
  • Low Temperature Co fired Components
and others such as: Piezo, HTCC, EMI filters, etc. multi-layer based electronic components have similar production technologies, based on thin layer ceramic technology.
 
There are two core technologies known, so-called dry and wet technology.
 
Nowadays dry technology is most commonly used for production of MLCC, MLCI etc. components.
 
Here are basic production steps and suitable machines for dry production process:
 
  • Ceramic slurry preparing: (BL-6A) Purpose of this step is to prepare ceramic powder to thin layer cast able suspension. For this purpose different types of jar mils are used.
     
  • Casting: ( CAM-22, CAM-M1) To form thin ceramic foil from suspension for MLCC and other multilayer based components casting machines are used. You can chose between two different types of machines depending on further technology steps: - CAM-22 produces free standing ceramic tape and - CAM-M1 produces ceramic tape cast on carrier film.
  • Pattern printing  and stacking: Two technologies are used to print pattern on the ceramic tape:
     
    • print on stack tech where stacking and printing is done simultaneously (PAL-9, FSP-10 for ferrites)
    • separate printing and separate stacking (automatic run RTP-10 + stacker ST-10 or for manual operation one of our P-160 to P-200A printers can be used and IS-3M manual stacker or IS-3A automatic stacker).
  • Individual printed sheets can by dried in a (dryer SD-3).
     
  • Punching: Some components like MLCI or LTCC requires punched sheets before printing and stacking to be used in order to have connections between individual layers (PAM-4S). Punched sheet requires via filling in order to have good connections between the layers. For this application a P-200AVF printer can be used.
     
  • Laminating: After stacking the stack has to be laminated by pressure and temperature in order to achieve compact stack. For most components, including MLCC, isocratic pressing process is used in order to achieve uniform pressure on the surface (ILS-6A machine). For some components an axial press is used (TPR-8)
     
  • Slitting: Is a process where the stack is cut after laminating in to individual pieces. For this purpose our CM-14 automatic cutter can be used. If the technology requires individual sheets before printing a SC-1 sheet cutter cuts the sheets automatically from a roll of tape.
     
  • In further steps a cofiring, contact termination (ILS-6A), testing & sorting (CS-10) and packaging (CTM-12) is done.
The most suitable technology for particular application depends on products type, production volume and dimension of product.
 

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